Semiconductor devices. Mechanical and climatic test methods - Temperature and humidity storage1 Scope This part of IEC 60749 provides a test method to evaluate the endurance of semiconductor devices used in high temperature and high humidity environments. This test method is used to evaluate the endurance against corrosion of the metallic interconnection of chips of semiconductor devices contained in plastic moulded and other types of packages. It is also used as a means of accelerating the leakage phenomena due to the moisture penetration

that contributes to the stability and integrity of foundation construction works

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This part of ISO 12219 specifies the design

management and use of buildings is defined by regulation and described in a number of documents including BS 9999 and the BS 7974 series

Manufacturing unit of glass fibre fabric

BS EN 61076-3-001:2008 supersedes EN 61076-3-001:2000

This code of practice does not cover civil engineering works for which reference should be made to BS 6031

Who is PD CEN/TS 17332 - Organic substances in eluates of construction products for

Functional aspects

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The sampling schemes defined in this part of ISO 2859 are applicable

A stronger emphasis on the responsibility of leadership