Semiconductor devices. Micro-electromechanical devices - Bend testing methods of thin film materials1 Scope This part of IEC 62047 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 m and 10 m. Thin films are used as main structural materials for Micro electromechanical Systems (abbreviated as MEMS in this document) and micromachines. The main structural materials for MEMS, micromachines, etc., have special features, such as a few micron meter size, material

operated and maintained by one or more organizations

An automatic pipette consists of a piston that displaces air to create a vacuum when its plunger is pressed

Scaled devices in test facilities (tank or scaled sea conditions) where any scaling would need to be carried out to extrapolate results for a full scale device

product specific standards

health effects

as indicated above

or e-learning centres and other organizations which may provideassessment facilities on an occasional basis

or other international or suitably accredited organizations

as well as the incomplete threads

BS EN IEC 61850‑8‑2 is basically a set of specifications that details layered utility communication architecture

BS ISO 22900-2 covers the descriptions of the application programming interface (API) functions and the abstraction of diagnostic protocols

BS ISO 22180 is useful for: